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Posts Tagged 'Optical Interconnect Packaging'

  • August 16, 2021

    Highly Integrated Silicon Photonics Light Engines in High-Speed Data Transport

    By Radha Nagarajan, SVP and CTO, Optical and Copper Connectivity Business Group

    The exponential increase in bandwidth demand will drive continuous innovation in, and deployment of, data movement interconnects for Cloud and Telecom providers.  As a result, highly integrated silicon photonics platform solutions are expected to become a key enabling technology for the cloud and telecom market over the next decade.

    What Does Highly Integrated Silicon Photonics Platform Mean for the Infrastructure Business?

    As speed continues to go up, optical will replace copper as the primary conduit of the digital bits inside Cloud data centers.  Marvell is investing heavily in silicon photonics to complement our high-speed CMOS technologies in data center interconnects to accelerate this transition.

    • Silicon photonic solutions have been successfully deployed inside Cloud data centers for 100G to compete with traditional “chip-and-wire” discrete solutions.  We expect silicon photonics will gain market share as the Cloud providers transition to the next bit rate of 400G.
    • Integrated silicon photonics platform solutions have intrinsic advantage over conventional packaging solutions at ever increasing baud rates.
    • Hyperscale data centers have limited power and cooling available for severs and interconnects. Integration technology is attractive where space and power savings are critical.
    • Integrating optical components on a silicon interposer can leverage the cost benefits of large-scale automated electronics assembly eco-system versus the traditional “chip-and-wire” optical industry.
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