SANTA CLARA, Calif. – September 28, 2023 — Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, will showcase its latest optical connectivity and switch solutions to address the exploding demand for artificial intelligence (AI), cloud, carrier, and other distributed, data-intensive workloads next week at the European Conference on Optical Communication (ECOC). Europe’s largest optical communications event, ECOC takes place October 1-5 at the SEC Centre in Glasgow, Scotland.
Marvell executives will also present at sessions at both the ECOC conference and expo.
Demonstrations:
At stand #960, Marvell will showcase its comprehensive portfolio for networking and connectivity, including:
In a fireside chat with the Next Platform, released yesterday, Achyut Shah, Senior Vice President and General Manager of the Connectivity Business Unit at Marvell, discusses the coming transformation in networking and interconnects, including the technologies above.
Presentations and Panels
Sunday, October 1st
3:15-4:30 p.m.
Workshop: Su.B.3 - DSP Evolution for 2030 and Beyond (two-part workshop)
Session 2: Single Lambda at High Baud Rate or Multi Lambda Transponder?
Marvell Speaker: Stephen Adolph, Associate Vice President, Coherent DSP – Connectivity BU
Location: Boisdale - Ground Floor
Monday, October 2nd
3:40-4:30 p.m.
Session: Panel 1: DCI Towards 100T and Beyond
Marvell Speaker: Samuel Liu, Senior Director, Product Line Management, Coherent DSP – Connectivity BU
Location: Market Focus Theatre
Tuesday, October 3rd
8:30-9:00 a.m.
Session: Tu.A.7.1: Recent Advances in Low-Power Digital Signal Processing Technologies for Data Center Applications
Marvell Speaker: Dr. Radha Nagarajan, SVP and CTO, Optical and Cloud Connectivity Group
Location: M2-M4, First Floor
About Marvell
To deliver the data infrastructure technology that connects the world, we’re building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world’s leading technology companies for over 25 years, we move, store, process and secure the world’s data with semiconductor solutions designed for our customers’ current needs and future ambitions. Through a process of deep collaboration and transparency, we’re ultimately changing the way tomorrow’s enterprise, cloud, automotive, and carrier architectures transform—for the better.
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